SAMSUNG 2.3D CUBE-R
Pending · Under Examination LIVE/APPLICATION/Under Examination
What this record means
The record shows a live, pending application on the Principal Register owned by Samsung Electronics Co., Ltd., filed on February 10 2026 and currently “Applicant’s response to a non‑final Office action has been entered,” with the latest status update on September 8 2026. The goods and services are limited to semiconductor‑related items and services: class 009 covers semiconductor packaging platforms, chips, wafers and related substrates; class 040 includes etching, wafer‑level processing, custom semiconductor packaging and substrate foundry services; and class 042 covers research, design, testing, quality‑control and consulting services for semiconductor packaging and related technology. A similar name would raise the closest record‑based concern if used for any of those semiconductor products or services, but the record does not extend control to unrelated fields. The prosecution history shows only the normal back‑and‑forth of a non‑final Office action and a response, with no indication of opposition, cancellation or other enforcement activity. I'd treat this as a meaningful concern for anyone planning a mark in the semiconductor arena.
Informational only - not legal advice.Mark Trademark, Service Mark
| Drawing type | 4 - STANDARD CHARACTER MARK |
| Filing basis | Foreign Registration (§44(e)). |
| Status | Applicant's response to a non-final Office action has been entered. The application is being returned to the examining attorney for further review. To view all documents in this file, click on the Trademark Document Retrieval link at the top of this page. |
Key dates
| Application filed | Feb 10, 2026 |
| Status date | Sep 08, 2026 |
Goods & services
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.
Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others.
Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.
Owner & representation
| Owner | SAMSUNG ELECTRONICS CO., LTD. |
| Address | 129, Samsung-ro, Yeongtong-gu, Suwon-si,, Gyeonggi-do KOREA, REPUBLIC OF 16677 |
| Entity | Corporation - organized in KOREA, REPUBLIC OF |
| Attorney of record | Daniel I. Schloss |
| Correspondent | Daniel I. Schloss |
| Attorney email | g********@*****.com |
| Correspondent email | 4 emails |
| Correspondent phone | 1********6 |
| Correspondent address | New York, NEW |